Topic: Reworking and Reballing Todays Advanced Technologies

With the advent of fewer lead-free packages and the unavailability of some devices in a lead-free alloy, many users find they do not have the right balls on the devices they are using. This teaching session tackles methods of reballing, including the solder preform and stencil technique. Participants will also learn about the various methods used to rework bottom-terminated components, such as QFNs, LGAs and the like.

What you will learn:

  • Handling of parts for reballing, leadless and other fine pitch device rework
  • Process flow and methods for reballing and leadless device rework
  • IPC-A-610 inspection criteria
  • IPC-7711/7721 procedures
  • Bake and dry packaging, reflow profiling and part marking issues
  • Plastic and ceramic package reballing process - demo
  • Leadless device process


    • Speaker: Bob Wettermann, BEST, Inc:

    Bob Wettermann is currently president of BEST, Inc and holds the title of Master Instructor. He is an electrical engineer with extensive experience in marketing, sales and design. Wetterman holds several patents in surface science,factory automation products as well as PCB rework and repair products. He has served the SMTa community in Wisconsin and Indiana and has spoken at numerous IPC and SMTA conferences and authored numerous papers related to PCB rework and repair.